High performance Copper heatpipes with a fusion bonded copper powder wick.
Patented CDC technology 4 direct touch heatpipes creating a gap-less contact surface
Aluminum Fin Array with New Tunnel Effect layout for improved heat dissipation.
4th Generation Bearing MTBF of 160,000 hours thanks to highly durable POM components.
Redesigned Fan-blades that create vortices to boost airflow without creating more noise.
Smart Fan engine stops the fan when blocked to prevent damage, and automatically restarts the fan when it has been cleared.
Universal mounting system for all Intel and AMD platforms.
Each fin-blade of the Hyper 212X features 4 X-shaped vents surrounding a Heatpipe. Oriented in a 45 degree angle to the airflow these vents create areas of higher and lower air pressure which results in several controlled vorteces. The relatively strong gusts of these tiny random and chaotic turbulences reduces overall airflow but improves airflow where it matters next to the heatpipes.
Funnel shaped aluminum fins and a series of perforated dimples guide the airflow towards the heatpipes. Here special X-Vents, that act similar to tiny airplane wings and prevent deadspots behind and between heatpipes. The combination of both of these patent pending technologies results in notably higher airflow over the heatpipes and the adjacent fin area, which ultimately reduces CPU temperatures.
The POM bearing coating with Polyoxymethylene material which usually used in precision parts requiring high stiffness and low friction does not need to replace lubricant and it also provides consistently lower friction levels than the traditional bearings. Thanks to all these advantages (Self-lubricating, lower friction, and dustproof), the MTBF has been pushed up to an incredible 160,000 hours.